Intel’s revolutionary chip manufacturing process with High-NA EUV Technology revealed.

TLDR:

• Intel unveils 14A chip manufacturing process using high-NA EUV technology.
• Intel is preparing for mass production by 2025 with ASML’s high-NA test equipment.

Intel has announced the introduction of the 14A chip manufacturing process, incorporating ASML’s advanced high-NA-EUV technology. This development was revealed during the IFS Connect livestream, which showcased the 14A node and its enhanced version, 14A-E. The 14A technology will involve the use of high-NA EUV machines from ASML with a numerical aperture of 0.55, allowing for the creation of smaller transistors through finer patterning on silicon wafers. Intel has begun receiving initial modules of ASML’s high-NA test equipment and is gearing up for mass production using this technology by 2025.

Specific performance and transistor density metrics for the 14A nodes have not been released, and the production start schedule is yet to be confirmed. However, test production for the 14A-E version is slated for 2027. Furthermore, Intel’s roadmap includes additional process variations denoted by suffixes like ‘E’ for expanded features, ‘T’ for through-silicon via optimization, and ‘P’ for performance improvements, aligning with industry trends to cater to diverse application needs.

Intel is also working on other initiatives such as the Intel 3 series and a collaboration with UMC on the 12nm node. Intel Foundry Services, now known as Intel Foundry, is expanding its customer base and collaborating on significant projects like manufacturing chips for Microsoft using the 18A process. This roadmap update underscores Intel’s strategic focus on advanced manufacturing capabilities and partnership expansion in the semiconductor sector.