Priya PatelTLDR:
Key Points:
- Samsung is switching to MR-MUF technology for its future-gen HBM products, following SK hynix.
- Samsung has been facing yield issues with its NCF technology, prompting the switch to MR-MUF.
In a move to address yield issues with its HBM products, Samsung is reportedly transitioning to MR-MUF technology for its next-gen HBM chip production. This decision comes after the company faced production issues with its current non-conductive film (NCF) technology. The adoption of MR-MUF technology, pioneered by SK hynix, reflects Samsung’s efforts to improve its production yields and compete in the future-gen AI GPUs market.
Despite initial denials, Samsung has confirmed plans to use MR-MUF technology in its upcoming HBM products. The company’s current HBM3 chip production yields are significantly lower than competitors like SK hynix, prompting the move to MR-MUF. While mass production of the new chips using MR-MUF technology is expected next year, Samsung is already in talks with material manufacturers to secure the necessary materials for production.
Analysts believe that Samsung’s adoption of MR-MUF technology represents a strategic shift for the company, as it seeks to address the limitations of its NCF technology and improve its competitiveness in the HBM market. With SK hynix leading the way in HBM development, Samsung’s decision to follow suit indicates a significant development in the industry landscape.
